Intel plans to build a semiconductor substrate manufacturing facility in India. The company is partnering with 3D Glass Solutions, Inc. (3DGS) to construct a facility in the eastern state of Odisha. The facility will take about six years to build and will cost $3.3 billion in joint investments from the two companies.
Once built, the facility will focus on producing high-density interconnect substrates and advanced packaging glass core substrates, which are used as bases for attaching semiconductor components, such as compute or graphics tiles. The project is pitched to create 1,800 jobs in and around the Bhubaneswar-Khurda region (via Yahoo Finance).
The chief minister of Odisha, Mohan Charan Majhi, wrote on X, “This transformative investment will create high-skilled employment opportunities for our youth, attract ancillary industries and accelerate Odisha’s transition from traditional industries to advanced manufacturing, innovation and knowledge-driven growth.”
India has been trying to catch the eye of the semiconductor industry with billions of dollars in subsidies. Intel’s Odisha facility joins eight other projects currently underway throughout the country, though the US company’s latest investment is dwarfed by Tata Electronics’ $14 billion build in Gujarat, near India’s western coast.
This latest push to pique the interest of the semiconductor industry is part of India Prime Minister Narendra Modi’s ‘Make in India‘ initiative. Very simply put, PM Modi wants the country to become a manufacturing hub that could rival China.
Odisha is entering a decisive new era of industrial and technological transformation. Today, we signed an MoU with Intel Corporation and 3DGS Inc. for the establishment of an Advanced Packaging Glass Core Substrate Manufacturing Facility in the Bhubaneswar–Khurda region, a… pic.twitter.com/IgQPNdgtO6May 29, 2026
Why? Well, it almost goes without saying, but semiconductor manufacturing can be extremely lucrative: SK Hynix, Micron, and Samsung have all joined the $1 trillion market cap club as a result.
Given the AI industry’s hunger for silicon and the knock-on effect of the memory supply crisis, it’s also no surprise that many major players are accelerating construction plans to meet demand. For instance, TSMC, the largest semiconductor manufacturer in the world, is reportedly sold out on capacity until 2028, and even its next-gen Arizona fab is fully booked before it has even been built.
